Devices and TO-Cans

Devices and TO-can CyOptics supplies Indium Phosphide chips and TO-cans as technology enablers for TOSA/ ROSA, large form factor component and module manufacturers. CyOptics has been a long-time industry leader in the design, fabrication and quality assurance of high-performance laser and detector chips, with over 25 million devices operating in the field and with >350 billion service hours (<1 FIT) since 2005 providing an unsurpassed record for ultra-high reliability. For Dense WDM applications up to 10Gbps, CyOptics offers class-leading capabilities in the management of direct modulated (DML) and electro-absorptive modulated (EML) lasers at C and L band wavelengths, for assured supply and flexibility. High temperature DFB, Fabry Perot and APD detector chips up to 10Gbps as well as TO-can based solutions compliment the product portfolio.

Data Rate Description Product Code
CW 1.5 µm High power DFB chip, CW, DWDM 295M
2.5 Gb/s 1.3 µm FP chip for Uncooled applications up to 10 km 299F
2.5 Gb/s 1.3 µm DFB chip for Uncooled applications up to 40 km, & CATV 293BU
2.5 Gb/s 1.3 µm DFB chip for Uncooled applications (CWDM) 293Bxxx
2.5 Gb/s 1.3 µm Expanded Beam (XBL) DFB chip for Uncooled applications up to 40 km 293C
2.5 Gb/s 1.5 µm DFB chip for Uncooled applications up to 80 km 295J155
2.5 Gb/s 1.5 µm DFB chip for Unooled applications up to 80 km, CWDM 295Jxxx
2.5 Gb/s 1.5 µm EML chip for Cooled applications up to 640 km, DWDM 294W
2.5 Gb/s APD chip/ chip on carrier 124NLV
2.5 Gb/s 1.3 µm DFB chip in TO-can for 40 km Uncooled applications TO293Bx
2.5 Gb/s 1.3 µm DFB chip in TO Can for Uncooled applications (CWDM) TO293Bxxx
2.5 Gb/s 1.5 µm DFB chip in TO can for 80 km applications TO295J
2.5 Gb/s 1.5 µm DFB chip in TO-can for up to 80 km uncooled applications, CWDM TO295Jxxx
2.5 Gb/s 1.49 µm DFB chip in TO-can for FTTx applications TO295J149x
2.5 Gb/s 1.5 µm DFB chip in TO-can for 80km uncooled applications TO295J155x
10 Gb/s 1.3 µm FP Chip for Wide-Temperature Uncooled applications up to 1km 299K
10 Gb/s 1.3 µm DFB Chip for Wide-Temperature Uncooled applications up to 20km 293K
10 Gb/s APD chip/ chip on carrier 124EAT
10 Gb/s 1.3 µm FP Chip in TO Can for Wide-Temperature Uncooled applications to 1km TO299K
10 Gb/s 1.3 µm DFB Chip in TO Can for Wide-Temperature Uncooled applications up to 20km TO293K