At CyOptics we design and manufacture optical components and modules on the basis of Indium Phosphide and Silica-on-Silicon technologies. Our design and fabrication expertise is based on more than 25 years of investments, including those made by the former optoelectronics divisions of Lucent Technologies and Bell Labs, which we obtained through our acquisition of a division of TriQuint Semiconductor, Inc. in 2005, and our broad portfolio of proprietary technologies, which form the foundation of our technical expertise and extensive industry know-how. Many members of our team are considered innovators in the Indium Phosphide semiconductor photonics market.
While most of our competitors in recent years have outsourced their manufacturing, in whole or in part, we are one of the few companies in our industry with vertically integrated technology and manufacturing platforms that span from Indium Phosphide and Silica-on-Silicon Planar Lightguide Circuit, or PLC, chip fabrication to proprietary, highly automated assembly and test facilities. Our in-house capabilities allow us to offer a dependable supply of quality optical components and modules. We control all phases of the development and manufacturing process in-house and leverage a comprehensive library of proprietary and commercially available design tools to accurately model and optimize the optical, electrical, thermal and mechanical properties prior to fabricating our devices and packages. The increasing complexity of optical devices makes accurate performance modeling necessary to reduce the number of design iterations thereby reducing our customers’ time to market and enabling them to make more efficient engineering investments.
We also have developed extensive expertise in the design and large scale fabrication of PICs, and are one of the few companies with all the key technologies in-house that enable the efficient design and the scalable, reliable, high volume fabrication of monolithic and hybrid PICs. In monolithic or single chip PICs, we leverage our advanced design, process know-how and epitaxial growth techniques to integrate multiple devices and/or functions into a single Indium Phosphide chip. In hybrid PICs, we utilize our highly automated sub-micron precision assembly platform to integrate multi-chip optical devices that are coupled using optical interconnects into a single package.