Packaging, Assembly and Test
CyOptics has accumulated a significant knowledge base in laser packaging, and in mechanical, optical, thermal and high frequency design. Laser diodes and photo-detectors are particularly sensitive to external forces, electro static fields and chemical environments, so they are typically housed in hermetically sealed packages.
The laser diodes and photo-detectors are typically placed on special silicon or ceramic submount before being packaged into the mechanical housing together with certain electronics and other optical and mechanical elements. Substantial investments have been made since 1995 in our in-house designed and built packaging equipment platforms and we believe that our assembly and test operations have the highest level of versatility and automation in our industry.
We use pick-and-place robotics to mount the various optical, electrical and thermal elements in packages that support applications from low cost to high reliability and power, housing micro-optics, hybrid and monolithically integrated devices. The key differentiation of our automation equipment is the capability to achieve sub-micron alignment precision between optical elements within the mechanical housing guaranteeing low optical power loss for hybrid or multi-chip integration.